The invention discloses a novel antioxidized leadless solder suitable for wave soldering. The solder includes the following raw materials in weight percentage of Cu 0.5-1.5%, Ni 0.02-0.12%, Fe 0.01-0.10%, and P 0.002-0.01%, one or more trace elements of Mn, Al, Si, and S, and the balance of Sn. The novel leadless solder has lower melting points, good antioxidizability and wetability, and has higher tensile strength and creep resistance capability. Cu forms a tin-copper eutectic alloy matrix, Ni can suppress the growth of whisker, and proper amount of Fe or Mn can form a second phase particle, so that the tensile strength and the creep resistance performance of the solder are improved; P, preferably, and 0 form a compact oxide to prevent the oxidation of the fusion tin-copper leadless solder, and S can further improve the antioxidation performance and flowing property of the solder; and proper amount of Al or Si can enhance the antioxidation effect of P and reduce the tin slag output during the wave soldering.