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发明授权
CN104604343B 安装结构体及增强用树脂材料的供给方法 有权

安装结构体及增强用树脂材料的供给方法
摘要：
提供一种电子元件的安装结构体及电子元件的安装方法，即使对于在基板上的竖立高度较高的电子元件也具有充分的增强效果，并且，即使电子元件的形状等发生变更也能够容易地加以对应。安装结构体(1)利用接合金属(3)使基板(2)与竖立设置于该基板(2)上的电子元件(4)接合，增强用树脂体(5)跨接并粘接于基板(2)与电子元件(4)，所述增强用树脂体(5)由多个增强用树脂层(5a)构成，所述增强用树脂层(5a)以沿着所述电子元件(4)的竖立设置于基板(2)上的侧面(4a)的姿态在电子元件(4)的竖立设置的高度方向上发生层叠而构成所述增强用树脂体(4)。
摘要（英）：

A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.

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