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发明公开
CN104505349A 加强铝线键合焊点可靠性的方法 无效 - 驳回

加强铝线键合焊点可靠性的方法
摘要：
本发明公开了一种加强铝线键合焊点可靠性的方法，应用于铝线与铜引线框架的焊接操作中，在传统的第一个焊点增加焊接第二个焊点，第二个焊点采用比第一个焊点用劈刀嘴部更短的短嘴劈刀，第二个焊点的起始位置为距离第一个焊点2倍以上-4倍的铝线的线径；第二焊点的总长度大于第一焊点的长度，然后用切刀连同铝线的尾部一起切去。本发明提高了微电子器件电连接的可靠性，能够实现连续焊接作业。
摘要（英）：

The invention discloses a method for enhancing reliability of aluminium wire bonding solder joints and is applied in soldering operation of an aluminium wire and copper lead frame. A second solder joint is additionally soldered on a traditional first solder joint, and adopts a short-mouth chopper with a mouth part being shorter than that of mouth part of a chopper for the first solder joint; the initial position of the second solder joint is the wire diameter of the aluminium wire which is 2 times to 4 times of the distance away from the first solder joint; the total length of the second solder joint is greater than the length of the first solder joint, and then the tail part of the aluminium wire is cut by a cutter. According to the method, the reliability of electrical connection of microelectronic devices is improved, and the continuous soldering operation can be realized.

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