The invention aims to provide an electronic module that can be miniaturized, and a method for manufacturing the same. The electronic module (1) provided with: an electronic module (10) having a substrate (11) that has a principal surface (11a) and a principal surface (11b), and also having an electronic element (12) mounted on the principal surface (11a); an electronic module (20) thermally connected to the electronic module (10) via connecting members (18, 19), the electronic module (20) having a substrate (21) that has a primary surface (21a) and a primary surface (21b) and is disposed so that the primary surface (21a) faces the primary surface (11a), and also having an electronic element (22) mounted on the primary surface (21a) and electrically connected to the electronic element (12) via the connecting member (18), and an electronic element (23) mounted on the primary face (21b) and electrically connected to the electronic element (12) via the connecting member (19)that passes through the substrate (21) in the thickness direction; and a heat sink (30) internally provided with a storage section (31a), the heat sink (30) storing the electronic modules (10, 20) in the storage section (31a) so that the primary surface (11b) is in contact with the inner wall surface of the storage section (31a).