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Invention Publication
CN104254423A 偏流板和喷流装置 有权

偏流板和喷流装置
Abstract:
本发明提供一种偏流板和喷流装置。该偏流板是对改变熔融焊锡的流动方向的偏流部件的结构进行设计而成的，如图1所示，其具备：半圆筒板(11)，其具有规定的内表面形状且具有规定的高度，立设于规定的基板上，用于改变熔融焊锡的流动方向；半圆筒板(12)，其具有规定的内表面形状且具有规定的高度，配设在立设有半圆筒板(11)的基板(13)上，用于改变熔融焊锡的流动方向。半圆筒板(11)和半圆筒板(12)以该半圆筒板(11)的内表面与半圆筒板(12)的端部对置且半圆筒板(12)的内表面与半圆筒板(11)的端部对置的方式相对。根据该结构，能够将熔融焊锡喷出到目标位置，并且能够使熔融焊锡的喷流高度的宽度方向分布均匀。
Abstract(English):

The present invention comprises: a drift plate on which the structure of a drift member is devised to change the direction of the flow of molten solder; a semi-cylindrical plate (11) that has a predetermined inner shape and a predetermined height as illustrated in Fig. 1 and is erected on a predetermined substrate to change the direction of the flow of the molten solder; and a semi-cylindrical plate (12) that has a predetermined inner shape and a predetermined height and is disposed on the substrate (13) where the semi-cylindrical plate (11) is erected to change the direction of the flow of the molten solder. The semi-cylindrical plate (11) and the semi-cylindrical plate (12) are opposed to each other so that an inner surface of the semi-cylindrical plate (11) faces an end portion of the semi-cylindrical plate (12) and an inner surface of the semi-cylindrical plate (12) faces an end portion of the semi-cylindrical plate (11). According to the structure, the molten solder can be jetted to a target position, and the width direction distribution of the jetted height of the molten solder can be uniform.

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