A curable resin composition containing a (meth)acrylate monomer having an aromatic ring, a non-conjugated vinylidene group-containing compound represented by general formula (1), and/or a thermal radical polymerization initiator and/or photo-radical polymerization initiator (where the non-conjugated vinylidene group-containing compound does not include the (meth)acrylate monomer) (R11, R12, R15, and R16 each independently represent a substituent group, and A represents an atomic group needed in order to form a cyclic structure) makes it possible to produce a cured product having minimized occurrence of burring during molding, high favorable product yield rate after molding, favorable heat coloration resistance, and low Abbe number.