The invention discloses an environment-friendly polishing compound for a semiconductor. The environment-friendly polishing compound is characterized by comprising the following substances in parts by weight: 11-14 parts of monocalcium phosphate, 2-5 parts of phosphoric acid, 9-13 parts of monopotassium phosphate, 1-3 parts of silicon dioxide, 21-23 parts of thiocyanate, 4-17 parts of salicylate, 8-13 parts of EDTA (Ethylene Diamine Tetraacetic Acid), 3-8 parts of oil removal agent, 8-10 parts of potassium sulfate, 10-16 parts of anhydrous sodium sulfate and 5-9 parts of polypropylene. The environment-friendly polishing compound has the beneficial effects of low corrosion speed, good polishing effect and little damage to the semiconductor.