A physical quantity sensor includes an IC chip and a package base mounted with the IC chip. The package base includes a first wiring layer provided with bonding pads connected to the IC chip via a bonding wire, a second wiring layer overlapping the first wiring layer in plan view, and an insulating layer provided between the first wiring layer and the second wiring layer. A contour of a wiring pattern provided on the second wiring layer (of the second wiring layer) is arranged in a position not overlapping the bonding pads in plan view.