A provided module structure used for cooling hard-shell cells comprises a module frame and a hard-shell cell, and is characterized in that the module frame is assembled by a plurality of independent structure bodies, each cell in the module is clamped by the independent structure body, and the independent structure bodies are connected into an integer in a mechanical manner. The module is convenient to assemble, and is capable of providing relatively high thermal conduction efficiency, and is applicable to both liquid cooling and air cooling.