知搜-全球专利检索

  1. 登录
  2. 注册
发明授权
CN103959501B 用于包封有机电子装置的光可固化压敏粘合膜、有机电子装置以及包封该装置的方法 有权

用于包封有机电子装置的光可固化压敏粘合膜、有机电子装置以及包封该装置的方法
摘要：
本发明的示例性实施方案涉及一种包含丙烯酸类聚合物、环氧树脂和阳离子光聚合引发剂的用于光可固化粘合剂的组合物；含有密封材料的有机电子装置，所述密封材料通过使用作为由包含所述组合物的膜制成的模制产物的粘合膜而含有该组合物；以及使用所述粘合膜制备所述有机电子装置的方法。更具体而言，所述制备有机电子装置的方法包括如下步骤：将粘合膜与上层板结合，并通过在粘合层的上表面上照射光而进行光固化；以及将光固化后的粘合层结合至其上提供有有机发光二极管的下衬底，由此通过对上表面的密封而确保了机械性能，通过甚至不直接在发光二极管上照射光的光固化而简化了制备过程，并且提高了二极管的使用寿命。
摘要（英）：

Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased.

公开/授权文献
0/0