This semiconductor module (30) is equipped with copper connectors (36a, 36b) for joining, by solders (34b, 34c), the top of electrodes (S, G) formed on the upper surface of a bare-chip transistor (35) with the top of wiring patterns (33b, 33c) included among a plurality of wiring patterns (33a-33d). A copper connector (36b) is equipped with an electrode-joining part (36bb) which joins to the electrode (G) on the bare-chip transistor (35), and a substrate-joining part (36bc) which joins to the wiring pattern (33c), and is positioned so as to face the electrode-joining part (36bb). The width (W1) of the electrode-joining part (36bb) in a direction perpendicular to one direction is narrower than the width (W2) of the substrate-joining part (36bc) in the direction perpendicular to the one direction.