Disclosed herein is a resin composition for a printed circuit board, an insulating film, a prepreg and a printed circuit board. The resin composition includes: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The insulating file is formed by the resin composition. The prepreg is formed in such a manner that a substrate is steeped by the resin composition. The printed circuit board comprises the insulating film. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.