Described herein are press fit optical vias to interconnect different levels of an electronic or electro-optical device, printed circuit board or connector. A device includes a device level having an optical component and another device level having another optical component. A press fit optical via interconnects the device level and the another device level. A press fit optical includes a barrel having a length for interconnecting between the device level and the another device level, an insertion point at an end of the barrel, and a lens at another end of the barrel. It includes an extraction collar between the lens the barrel, an insertion limit face between the extraction collar and the barrel, and a rotation key extending from the extraction collar and the insertion limit face. A plurality of swages are interposed on the barrel and the insertion limit face.