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发明公开
CN103531507A 模块承载托盘及IGBT模块的封装方法 无效 - 驳回

模块承载托盘及IGBT模块的封装方法
摘要：
本发明提供一种模块承载托盘及IGBT模块的封装方法，模块承载托盘包括底座和四个支撑销，所述四个支撑销可拆卸固定在底座上，所述四个支撑销分别与模块底板上的安装孔相对应，所述支撑销远离底座的一端为锥台，所述锥台的顶端的外径小于安装孔的内径，所述锥台底端的外径大于安装孔的内径，即所述锥台可嵌入安装孔中，所述支撑销可架空模块底板，减少底板与模块承载托盘的接触面。本发明还公开了一种采用上述模块承载托盘的IGBT模块的封装方法。本发明结构简单、合理、紧凑，克服了现有技术的诸多问题，用于IGBT模块封装具有有效防止底板污染、节约模块封装成本和提高模块封装效率的优点。
摘要（英）：

The invention provides a module bearing tray and an IGBT module packaging method. The module bearing tray comprises a base and four supporting pins, wherein the four supporting pins are detachably fixed on the base and respectively correspond to installation holes on a module base plate. One ends, far away from the base, of the supporting pins are frustums. The outer diameter of the top ends of the frustums is smaller than the inner diameter of the installation holes, and the outer diameter of the bottom ends of the frustums is greater than the inner diameter of the installation holes, namely, the frustums can be embedded into the installation holes. The supporting pins can build the module base plate on stilts and reduce the area of a contact surface between the base plate and the module bearing tray. The invention further discloses a method for packaging an IGBT module adopting the module bearing tray. The module bearing tray has a simple, reasonable and compact structure, overcomes multiple problems in the prior art, is used for IGBT module packaging and has the advantages that the base plate is effectively prevented from contamination, the module packaging cost is saved, and the module packaging efficiency is improved.

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