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发明公开
CN103531488A 半导体设备、制造半导体设备的方法和照相机 有权

半导体设备、制造半导体设备的方法和照相机
摘要：
本发明涉及一种半导体设备、制造半导体设备的方法和照相机。该半导体设备包括具有芯片安装区域和包围芯片安装区域的周边区域的第一构件、安装在芯片安装区域中的半导体芯片、以及固定到第一构件以覆盖半导体芯片的第二构件，所述制造半导体设备的方法包括：使用粘合剂将处于半导体芯片被安装在芯片安装区域中的状态下的第一构件的周边区域粘合到第二构件；以及在粘合剂开始固化后，在第一构件和第二构件之间产生应力，以在第一构件和粘合剂之间的部分以及第二构件和粘合剂之间的部分中的至少一个部分中局部形成间隙。
摘要（英）：

The present invention relates to a semiconductor device, method of manufacturing the same, and camera. A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.

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