The invention provides a method for preparing of a radiator-based copper foil-clad printed circuit board. A radiator adopted in the method is an aluminum profile with radiating fins. The method comprises the following steps that: firstly, the radiator is pressed and combined with copper foil through an insulation heat-conduction adhesive, such that an initial product can be obtained; the radiating fins of the initial product obtained from the step a are protected through using adhesive tapes, and the copper foil is etched, such that a circuit surface can be formed; the circuit surface is protected through using adhesive tapes, and desmutting treatment is performed on the radiating fins; and the adhesive tapes of the circuit surface are removed, and the radiator-based copper foil-clad printed circuit board can be obtained. The invention also provides a circuit board made through the method of the invention. When the copper foil is etched, the adhesive tapes are adopted to protect the radiating fins of the radiator, and therefore, the radiating fins can be protected from being corroded.