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发明公开
CN103378051A 电子设备 无效 - 驳回

电子设备
摘要：
一种电子设备，包括基板和电子部件。上述基板具有金属化布线。上述金属化布线包括金属化层和合成树脂膜。上述金属化层包含高熔点金属成分和低熔点金属成分，上述高熔点金属成分和上述低熔点金属成分相互扩散接合，附着于上述基板的表面。上述合成树脂膜与上述金属化层同时形成，覆盖上述金属化层的表面，膜厚在5nm～1000nm的范围。上述电子部件与上述金属化层电连接。
摘要（英）：

An electronic device includes a substrate and an electronic component. The substrate has a metallization trace. The metallization trace has a metallization layer and a synthetic resin layer. The metallization layer has a high-melting-point metallic component and a low-melting-point metallic component. The high-melting-point metallic component and the low-melting-point metallic component are diffusion bonded together and adhered to a surface of the substrate. The synthetic resin layer is formed simultaneously with the metallization layer to cover a surface of the metallization layer with a thickness in the range of 5 nm to 1000 nm. The electronic component is electrically connected to the metallization layer.

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