The invention provides a printed wiring board lamination and copper block embedding method which comprises the following steps: bonding a first substrate layer and a second substrate layer with a prepreg; slotting in positions where a copper block is embedded on the first substrate layer, the second substrate layer and the prepreg, wherein the slotting size is larger than the size of the copper block; respectively performing pre-lamination treatment on the first substrate layer, the second substrate layer and the copper block; laminating, wherein a resin flowing adhesive on the prepreg is made to flow out and be solidified while being heated in the lamination process, so that the first substrate layer, the second substrate layer, the prepreg and the copper block are bonded together, thus forming a whole; grinding to remove the prepreg flowing adhesive overflowed on the upper and lower surfaces of the copper block; and performing PTH (plating through hole) to ensure that copper layers are formed on the upper and lower surfaces of a laminated board composed of the first substrate layer, the second substrate layer, the copper block and the prepreg, thus enabling the copper block to be interconnected with the first substrate layer, the second substrate layer and the prepreg to form a whole, and realizing electrical interconnection.