Provided is a manufacturing method of a package where a gas generated between a base substrate forming wafer and a lid substrate forming wafer at the time of bonding these two wafers to each other can be easily discharged to the outside. In the method, the base substrate forming wafer and the lid substrate forming wafer are laminated to each other by sandwiching the base substrate forming wafer and the lid substrate forming wafer from both sides in the laminating direction using a lower jig and an upper jig arranged in a vacuum chamber thus forming a wafer bonded body having a plurality of cavities in each of which a piezoelectric vibrating piece is sealed, and the wafer bonded body is cut for every one of plurality of cavities thus forming a plurality of packages.