The invention discloses an electronic device casing and manufacturing method thereof. The electronic device casing comprises a metal substrate and a pattern portion made of ceramics and embedded in the outer surface of the metal substrate, and the pattern portion is formed on the metal substrate through chemical etching process and enamel process. The manufacturing method of the casing includes providing the metal substrate; performing chemical etching process to the metal substrate so that a groove is formed on the surface of the metal substrate; roughening the bottom of the groove; performing enamel process to the metal substrate so that ceramics are formed in the groove of the metal substrate and simultaneously superfluous ceramic layers are formed on the groove on the surface of the metal substrate; and grinding the surface of the metal substrate so that the superfluous ceramic layers are removed and the pattern portion made of ceramics and embedded in the groove is exposed out of the surface of the metal substrate surface. The electronic device casing manufactured through the method is provided touches and looks like ceramics, and the pattern portion has high abrasion resistance.