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发明公开
CN102510657A 多层电路板及包括其的电子装置 失效 - 权利终止

多层电路板及包括其的电子装置
摘要：
本发明是关于一种多层电路板及包括其的电子装置。多层电路板包括：第一金属层，包含第一讯号部；第一电子元件，设置于该第一讯号部；第二金属层；第一绝缘层，设置于该第一金属层与该第二金属层之间；第一接地部，设置于该第一金属层的侧边；以及板边金属层，配置于该多层电路板的一侧壁上，该板边金属层与该第一接地部电性连接，且与该第一讯号部无电性连接；其中，该第一电子元件与该第一接地部耦接。本发明使该第一电子元件所产生的热经由该第一接地部传导至该板边金属层。
摘要（英）：

The invention relates to a multilayer circuit board and an electronic device comprising the same. The multilayer circuit board comprises a first metal layer which comprises a first signal part, a first electronic component which is arranged in the first signal part, a second metal layer, a first insulating layer which is arranged between the first metal layer and the second metal layer, a first grounding part which is arranged on the side of the first metal layer, and a plate edge metal layer which is arranged on one side wall of the multilayer circuit board, wherein the plate edge metal layer is electrically connected with the first grounding part and is not electrically connected with the first signal part; and the first electronic component is coupled with the first grounding part. According to the invention, the heat generated by the first electronic component can be conducted to the plate edge metal layer through the first grounding part.

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