The invention relates to a silicon chip taking and placing device. A sucking disc is fixed on a connecting seat, a plurality of air holes are formed in the sucking disc, and a concave cavity is formed in the connecting seat; a lower end cover is fixed on the connecting seat, and a lower vent hole is formed in the center of the lower end cover and communicated with the concave cavity; a valve bodyis fixed on the lower end cover, an annular air inlet cavity is formed in the valve body, a middle vent hole is formed in the center of the valve body, the annular air inlet cavity is isolated from the middle vent hole through an annular wall, and an air inlet gap is reserved between the bottom part of the annular wall and the top part of the lower end cover; an upper end cover is fixed on the valve body, an upper vent hole is formed in the center of the lower part of the upper end cover, and at least two oblique exhaust holes are formed in the upper part of the upper end cover; a first jointis connected to one side of the valve body and is communicated with the annular air inlet cavity in the valve body; and a second joint is connected to the other side of the valve body and is communicated with the concave cavity in the connecting seat through a second air inlet passage. The silicon chip taking and placing device disclosed by the invention is skilful and reasonable in structure, and can not influence the positions of silicon chips beside a sucked silicon chip when sucking and releasing the silicon chip.