The invention relates to a method for manufacturing a micromechanical part made of reinforced silicon, comprising the steps of: micromachining the part, or a batch of parts, in a silicon wafer; forming, in one or more steps and over the entire surface of the part, a layer of silicon dioxide, so as to obtain a thickness of silicon dioxide that is at least five times greater than the thickness of native silicon dioxide; and removing the layer of silicon dioxide by chemical attack.