Provided are adhesive resin compositions that are halogen-free, have excellent adhesiveness, solder heat resistance and flame resistance, and excellent flow characteristics, and laminates and flexible printed wiring boards using the same. The resin compositions comprise a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin of 20,000 or greater to 150,000 weight average molecular weight, other thermoplastic resins and a curing agent. The compositions preferably also comprise a benzoxadine compound. Preferably, essentially no inorganic filler is mixed in.