Disclosed is a film-like circuit connecting material for electrically connecting a first circuit member, wherein a first circuit electrode is formed on a major surface of a first circuit board, with a second circuit member, wherein a second circuit electrode is formed on a major surface of a second circuit board, in such a manner that the first and second circuit electrodes face each other. The film-like circuit connecting material contains a film-forming material, a radically polymerizable compound, a radical polymerization initiator which generates a free radical when heated, and an isocyanate group-containing compound. In this film-like circuit connecting material, the isocyanate group-containing compound is contained in an amount of 0.09-5 parts by mass relative to 100 parts by mass of the total of the film-forming material and the radically polymerizable compound.