The invention relates to a packaging method of a silicon carbide power module. The packaging method comprises the following steps of: welding an aluminum nitride isolation layer on a molybdenum plate, placing a silicon carbide chip in a blank of the aluminum nitride isolation layer, and welding the silicon carbide chip with the molybdenum plate; welding a molybdenum block on the silicon carbide chip, and reserving a gate electrode lead slot on the molybdenum block; placing a lead in the gate electrode lead slot, arranging a compression ring on the lead, placing a spring used for crimping in the compression ring, and collecting and leading out the lead; and carrying out integral casting forming on the molybdenum plate, the silicon carbide isolation layer and the silicon carbide chip through using epoxy resin, installing a base, a tube shell and a tube cap, and packaging. The invention also discloses a silicon carbide power module. The invention ensures that the silicon carbide power module has higher reliability and stronger thermal cycle capacity under the working conditions of high power and high temperature.