The invention relates to a low-silver electro vacuum brazing filler metal used for sealing weld of an electronic device, which belongs to the technical field of brazing materials. The low-silver electro vacuum brazing filler metal comprises the following chemical compositions in percentage by mass: 41 to 43 percent of silver (Ag), 51 to 53 percent of copper (Cu), 4 to 6 percent of stannum (Sn), less than or equal to 2 percent of indium (In) and less than or equal to 0.4 percent of nickel (Ni). The low-silver electro vacuum brazing filler metal has the advantages of: contributing to reducing the silver content so as to save resources and reduce cost, and contributing to guaranteeing a proper melting point, high plasticity and high machinability so as to replace Ag72Cu brazing filler metal.