This invention provides a process for producing a prepreg with a carrier, which is excellent in impregnation properties and thickness accuracy and is particularly suitable for use in the production of a buildup-type multilayered printed wiring board, a prepreg with a carrier produced by the production process, and a process for producing a multilayered printed wiring board using this prepreg witha carrier. The process for producing a prepreg with a carrier is a process for continuously producing a prepreg with a carrier, comprising an insulating resin layer comprising a skeleton material of a textile fabric and is characterized by comprising the steps of (a) providing first and second carriers each with an insulating resin layer on one side thereof, superimposing the first and second carriers respectively on both sides of a textile fabric so that the insulating resin layer in the carrier faces the textile fabric, and bonding the first and second carriers respectively on both sides ofa textile fabric under reduced pressure, and (b) after the bonding, heating the assembly at a temperature at or above the melting temperature of the insulating resin.