Provided is an electronic component which can withstand the stress applied from a printed board, or the like. An electronic component (1a) has a cavity (9) sealed airtightly by a base (2) and a lid (5), and a crystal oscillator (6) is held on the upper surface of the base (2) by a supporting portion (7) in the cavity (9). The base (2) is composed of glass and a stress relaxing layer (3) composed of a conductive resin, or the like, is formed entirely on the bottom surface of the base (2). External electrodes (8, 4) connected with the electrode of the crystal oscillator (6) reach the bottom surface of the stress relaxing layer (3) via the side surfaces the base (2) and the stress relaxing layer (3), respectively. The electronic component (1a) is surface mounted by soldering the external electrodes (8, 4) formed on the bottom surface section of the stress relaxing layer (3) to a printed board.