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发明公开
CN101834235A 发光二极管封装结构及其制作方法 失效 - 权利终止

发光二极管封装结构及其制作方法
摘要：
一种发光二极管封装结构的制作方法。首先，提供一承载器及一发光二极管芯片。发光二极管芯片配置于承载器上，且发光二极管芯片位于一凹穴内。接着，填入一第一封装胶体于凹穴内。第一封装胶体覆盖发光二极管芯片，且第一封装胶体内掺有一荧光材料。进行一第一烘烤步骤，以使第一封装胶体呈半固化态。之后，填入一第二封装胶体于凹穴内，且第二封装胶体覆盖于第一封装胶体上。
摘要（英）：

The invention relates to a manufacture method of a light-emitting diode packaging structure, which comprises the steps of: firstly, providing a loader and a light-emitting diode chip, wherein the light-emitting diode chip is configured on the loader and is positioned in a pit; secondly, filling a first packaging colloid in the pit, wherein the first packaging colloid covers the light-emitting diode chip, a fluorescent material is doped in the first packaging colloid; thirdly, carrying out first roasting to enable the first packaging colloid to be in a semi-curing state; and fourthly, filling a second packaging colloid in the pit, wherein the second packaging colloid covers the first packaging colloid.

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