The invention provides a dealcoholized organosilicon sealant with damp-heat resistance and stable storage. The dealcoholized organosilicon sealant is characterized in that the organosilicon sealant comprises the following components according to parts by weight: 100 parts of alpha, omega-dihydroxy polydimethylsiloxane, 1-20 parts of mixed crosslinking agent, 1-20 parts of titanate catalyst, 0-300 parts of filler, 0-200 parts of low molecular weight silicone oil and 0-10 parts of tackifier. The invention further provides a preparation method for the dealcoholized organosilicon sealant, which is characterized in that: as titanate is selected as the catalyst and the mixed crosslinking agent is used, the storing and processing performances are improved; with excellent mechanical property, good damp-heat resistance and high storage stability, the obtained sealant is particularly applicable to adhesive bonding and encapsulating of various electronic and electrical appliances.