A heat transferring member for a solder handling device, an electric iron with the heat transferring member and an electric solder removing tool with the heat transferring member are disclosed. The heat transferring member comprises a heat transfer body for melting solder, and a pipe inserted into a hole formed in the heat transfer body, wherein heat from a heating member is conducted to the heattransfer body. The pipe includes a tubular-shaped substrate made of copper or copper alloy, and an aluminum oxide film formed at least on a peripheral surface of the tubular-shaped substrate. Thus the heat transferring member can prevent the conducting member from being oxidized and keep high heat transfer efficiency.