A multilayered printed wiring board, a multilayer PWB, and a method for manufacturing the same. The multilayer PWB comprises a first main surface (201) and an opposing second main surface (202), wherethe multilayer PWB has a height (h) being defined, by the distance from the first main surface to the opposing second main surface. The two surfaces and the height together define the thickness of the multilayer PWB. The multilayer PWB comprises a reference ground plane, a microstrip conductor (210) separated from the reference ground plane (230') by a first dielectric layer (250) and a striplineconductor (220) connected with the microstrip conductor and being separated from the reference ground plane (230' ') by a second dielectric layer (260). The reference ground plane is formed by two ormore different partial reference (230',230' ') ground planes positioned at different layers of the multilayer PWB. Furthermore, the reference ground plane is moveable from the first partial referenceground plane to the second partial reference ground plane when a signal current transits from the microstrip conductor to the stripline conductor, and vice versa.