Disclosed is a circuit connecting material for electrically connecting two circuit members each with a circuit electrode formed thereon in such a state that the circuit electrodes are disposed to faceeach other. The circuit connecting material contains an adhesive agent composition and electroconductive particles. The electroconductive particle comprises a nucleus formed of an organic polymer compound and a metal layer covering the nucleus. The metal layer has protrusions protruded toward the outside of the electroconductive particle. The metal layer is formed of nickel or a nickel alloy. Upon the application of a pressure to the electroconductive particle, the metal layer located on the inner part of the protrusion sinks in the nucleus.