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发明公开
CN101632177A 用于成像器装置的封装方法 无效 - 撤回

用于成像器装置的封装方法
摘要：
本发明揭示一种成像器装置，其包括至少一个定位在衬底的正表面上的光敏元件和一导电结构，所述导电结构至少部分地延伸穿过所述衬底中所界定的开口以导电性地耦合到第一表面上的电触点或接合垫。导电层压膜的绝缘材料和/或模制化合物材料定位在所述开口内所述导电结构的至少一部分与所述衬底之间。本发明还揭示一种装置，其包含衬底和位于所述衬底中的多个开口，其中所述开口中的每一者适于当所述衬底定位在成像器衬底上方并紧固到所述成像器衬底时定位在成像器装置上方。本发明还揭示一种形成成像器装置的方法。
摘要（英）：

An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the first surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.

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