The invention relates to a semiconductor lead processing device which comprises a stringing block, a cutter and a forming module, wherein a through hole used for feeding leads is arranged on the stringing block; the cutter is vertically fixed at the outlet side of the through hole of the stringing block; and a die cavity used for molding is arranged on the forming mould and is coaxial with the through hole of the stringing block. Compared with the prior art, the product produced by the semiconductor lead processing device has stable length and no defects of raw edges, bending, and the like ata notch, and a plurality of semiconductor lead products can be produced by different forming moulds.