The invention relates to the research field of boiling phase change heat transfer, in particular to a boiling heat transfer device of an electronic component. The boiling heat transfer device comprises a cooling plate fixed to the surface of the electronic component, a metal foam layer is sintered or welded on the upper surface of the cooling plate, the metal foam layer is provided with square column type microstructures with the width of 50 micron to 200 micron, and the interval between the square column type microstructures is 50 micron to 200 micron.