Provided is a method, a wire is wound around a roller having a plurality grooves and the running wire is pressed on the ingot while supplying a cutting slurry to the roller having the grooves to cut the ingot into wafers. In this method, a test is previously executed in which the ingot is cut while supplying the cutting slurry to the roller having the grooves during controlling the temperature ofthe supplied slurry, the relation between the axial direction displacement of the groove-provided roller and the temperature of the supplied cutting slurry is researched to set a supply temperature profile of the cutting slurry from the relation between the axial direction displacement of the groove-provided roller and the temperature of the supplied cutting slurry, the cutting slurry is suppliedon the basis of the supply temperature profile, and the ingot is cut while controlling the axial direction displacement of the groove-provided roller, thereby allowing all the wafers to be cut to have the same direction of warpage. Thus, a cutting method capable of easily cutting an ingot with good reproducibility so that all wafers can have one direction of warpage when a wire saw is used to cutthe ingot, is provided.