The invention discloses a device for separating components and parts on a circuit board and a substrate of the circuit board, which comprises a transmission part, a support part, a disassembly part and a guide plate, wherein the transmission part comprises a transmission frame and a transmission band device; the support part comprises a lining base and a support frame which comprises a work bed plate, a left upper beam and a right upper beam; the disassembly part comprises a left disk assembly, a right disk assembly and a transmission mechanism; the left disk assembly comprises a left step shaft, a left guide disk, a left dentiform cutter head and a left elastic limit device; the right disk assembly comprises a right step shaft, a right guide disk, a right dentiform cutter head and a right elastic limit device; and the guide plate is arranged between the transmission band of the transmission part and the left guide disk and right guide disk of the disassembly part. The separation device has strong self-adaptation and high efficiency, and simultaneously removes slicker solder in the disassembly process so as not to need heating and smelting the slicker solder again.