The invention relates to a substrate used for manufacturing multilayer circuit board, which comprises a plurality of circuit board unit regions, peripheral regions and at least one first air guide groove disposed in the peripheral regions. A first air guide groove is formed on the peripheral region of the substrate used for manufacturing multilayer circuit board, thereby, when a plurality of substrates are pressed to form a multilayer circuit board, the air between the adjacent layers are discharged into the first air guide groove in the pressing process; thus, the air between the layers of the multilayer circuit board can be eliminated as possible, and the layers of the multilayer circuit board can be combined more tightly.