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发明授权
CN101489722B 双面研磨装置用载具、及使用此载具的双面研磨装置和双面研磨方法 有权

双面研磨装置用载具、及使用此载具的双面研磨装置和双面研磨方法
摘要：
本发明涉及一种双面研磨装置用载具，是于双面研磨装置中，配设于贴附有研磨布的上下方转盘之间，为了保持研磨时包挟于上述上下方转盘之间的半导体晶片而形成保持孔的形态的双面研磨装置用载具，该载具的材质是钛，该钛制载具的表面粗糙度Ra为0.14μm以上。由此，可提供一种双面研磨装置用载具、使用此载具的双面研磨装置及双面研磨方法，于半导体晶片的双面研磨时，可安定、有效率、低成本地生产出可减少晶片外周塌、具有高平坦度的高质量晶片。
摘要（英）：

The present invention provides a carrier for double-side polishing apparatus which is set between upper and lower turn tables having polishing pads attached thereto and has a holding hole in which a semiconductor wafer sandwiched between the upper and lower turn tables is held at the time of polishing in a double-side polishing apparatus, wherein a material of the carrier is titanium, and surfaceroughness of the titanium carrier is 0.14 mum or above in terms of Ra. As a result, there is provided the carrier for double-side polishing apparatus, a double-side polishing apparatus, and a double-side polishing method that can stably and efficiently produce a high-quality wafer having reduced wafer peripheral sag and a high flatness at the time of double-side polishing of a semiconductor wafer.

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