A high-speed die bond method for crystal by automatic image recognition is characterized in that the die bond method comprises the following steps: (1) a wafer platform and a circuit board platform realize driving in X and Y direction, the two platforms all select a Bonder Head position moving up and down as an origin of coordinate, all the origins automatically reset to zero when starting up; (2) image data are input into a computer which is responsible for analyzing, computing and processing the input images, the computer can process a plurality of groups of image data at the same time and match and compute the deviation of coordinates of corresponding points in each group based on the requirements; (3) movement to the place right under the Bonder Head or right above the Bonder Head is carried out according to the regulated time sequence, the wafer is pressed and mounted on the circuit board, thus completing die bond. The method has the advantages that the automatic position controlof computer is adopted, the Bonder Head does not need reciprocation, the die bond efficiency is high, a plurality of groups of die bond images can be processed simultaneously, the cost is saved and the requirement of improving the die bond speed and accuracy is met.