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发明授权
CN101483213B 改善了散热的侧发光LED 失效 - 权利终止 转让

改善了散热的侧发光LED
摘要：
本发明涉及改善了散热的侧发光LED，并公开了光源和用于制造光源的方法。光源包括引线框、集成电路芯片和主体。引线框具有第一和第二部件。第一部件包括横向部分、芯片安装区和第一延伸部。集成电路芯片在芯片安装区中接合到第一部件并且与芯片安装区热接触。主体具有顶面、底面和侧面。第一延伸部被弯曲以提供从芯片安装区到侧面的热路径，第一延伸部的未与侧面接触的表面形成第一平坦接合表面。所述热路径比通过横向部分的热路径具有更小的热阻。
摘要（英）：

A light source and a method for making the same are disclosed. The light source includes a lead frame, an integrated circuit chip and a body. The lead frame has first and second sections. The first section includes a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is bonded to the first section in the chip mounting area and is in thermal contact with the chip mounting area. The body has top, bottom, and side surfaces. The first extension is bent to provide a heat path from the chip mounting area to the side surface, a surface of the first extension that is not in contact with the side surface forming a first planar bonding surface. The heat path has less thermal resistance than a heat path through the lateral portion.

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