The invention relates to a circuit board, in particular to a high-power printed circuit board component with radiating function in a high-frequency high-power circuit and the technique for realizing connection of a power amplifier thereof. The printed board component comprises a first printed board, a second printed board, a power tube and a radiator. The second printed board is a printed board for the first printed board to connect the high-frequency high-power apparatus. The second printed board is welded and fixed to the first printed board by the surface-adhering welding end at the side terminal. The power tube penetrates the open windows of the first printed board and the second printed board so as to be connected with the radiator. The pin of the power tube is welded to the second printed board. And the radiator is connected with the lower surface of the first printed board.