An electronic component (3) which has a shielding function and has the upper surface held at a reference potential, an electronic component (13) and a semiconductor component (4) are mounted on a wiring substrate (2). These components are covered with an insulating resin section (5), and a conductive layer (6) is formed on an upper surface of the insulating resin section (5). The conductive layer(6) is held at the reference potential by connecting the conductive layer (6) with a portion of the electronic component (3), which is held at the reference potential of the electronic component (3) and exposed from the insulating resin section (5). Thus, a small circuit module having excellent electromagnetic shielding function is provided.