The invention discloses a polishing method, substrate manufacturing method, and electronic apparatus manufacturing method. The polishing method configured to simultaneously polish both surfaces of a work comprises the steps of making a spacer contact a carrier so that the work can project from both surfaces of the carrier, the carrier having a hole configured to house the work, inserting an adhesive into a clearance between the work and the carrier, and detaching the carrier from the spacer and attaching the carrier to a polishing apparatus.