The invention provides an electronic component and manufacture method thereof, two electronic components can be stacked in a direction vertical to the surface of the substrate. The electronic component comprises a connector for connecting terminals in two-dimensional alignment and aligned at narrower pitch. The electronic component is connected with the other electronic component with a projecting electrode, comprising a substrate, a conductive interconnection element formed in the substrate and a connector snap-fitted into the projecting electrode, wherein the connector is formed by the conductive film depositing on the interconnection element and comprises a plurality of the beams that projects from the interconnection element in the direction vertical to the surface of the substrate, and holding surfaces projecting from each projection end of the beam to the inside of the beam and guiding surfaces retreating from each projection end of the holding surface towards the outside of the beam and extending along the direction from the base end of the beam towards the projection end.