To provide a mounted substrate in which a stress applied to a semiconductor package can be suppressed when the semiconductor package is mounted on a curved substrate. In a mounted substrate (1) in which a semiconductor package (20) is mounted on a curved substrate (10) having at least partly a curved surface, the curved substrate (10) includes a pedestal part (13a) made of an insulating material which is disposed at the portion of the curved portion thereof where the semiconductor package (20) is mounted and of which the upper surface is formed flat, and a plurality of pad parts (15a) disposed on the flat surface of the pedestal part (13a). The semiconductor package (20) is characterized in that it is mounted on the pad parts (15a).