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Invention Publication
CN101300912A 多层电路板的制造方法、电路板及其制造方法 失效 - 权利终止

  • Patent Title: 多层电路板的制造方法、电路板及其制造方法
  • Patent Title (English): Method for fabricating multilayer circuit plate, circuit plate, and method for fabricating the circuit plate
  • Application No.: CN200680041253.7
    Application Date: 2006-10-30
  • Publication No.: CN101300912A
    Publication Date: 2008-11-05
  • Inventor: 近藤正芳
  • Applicant: 住友电木株式会社
  • Applicant Address: 日本东京
  • Assignee: 住友电木株式会社
  • Current Assignee: 住友电木株式会社
  • Current Assignee Address: 日本东京
  • Agency: 隆天国际知识产权代理有限公司
  • Agent 郑小军
  • Priority: 321336/2005 2005.11.04 JP; 321406/2005 2005.11.04 JP
  • International Application: PCT/JP2006/321623 2006.10.30
  • International Announcement: WO2007/052584 JA 2007.05.10
  • Date entered country: 2008-05-04
  • Main IPC: H05K3/46
  • IPC: H05K3/46
多层电路板的制造方法、电路板及其制造方法
Abstract:
一种多层电路板的制造方法，包括：准备具有层间粘结剂的膜1，其中堆叠有第一保护膜102和第一层间粘结剂104；准备具有第一基底202和从所述第一基底202突出的导电柱204的第一电路板2；将该第一层间粘结剂的表面和包括导电柱的表面堆叠在一起；剥离该第一保护膜102；准备包括容置该导电柱204的导电焊盘302的第二电路板3；以及通过所述第一层间粘结剂104将所述第一电路板2和所述第二电路板3堆叠并粘合在一起，以使所述导电柱204和所述导电焊盘302彼此面对，其中在剥离过程中，在剥离该第一保护膜102时选择性去除该导电柱顶部206处的第一层间粘结剂104。
Abstract(English):

A method for fabricating a circuit board comprises steps of: preparing a film (1) with interlayer adhesive, in which a first protective film (102) and a first interlayer adhesive (104) are stacked; preparing a first circuit board (2) having a first substrate (202) and a conductive post (204) protruding from the first substrate (202); stacking the surface of the first interlayer adhesive and the surface having the conductive post; peeling off the first protective film (102); preparing a second circuit board (3) having a conductive pad (302) receiving the conductive post (204); and stacking and bonding the first circuit board (2) and the second circuit board (3) through the first interlayer adhesive (104) so that the conductive post (204) and the conductive pad (302) are opposed to each other. In the peeling off step, in addition to peeling off the first protective film (102), the first interlayer adhesive (104) at the top portion (206) of the conductive post is selectively removed.

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