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发明授权
CN101299902B 线路板的线路结构及其线路工艺 有权

线路板的线路结构及其线路工艺
摘要：
本发明公开一种线路板的线路结构及其线路工艺。一种线路板的线路结构，其包括介电层、至少第一线路以及多条第二线路。介电层具有表面、第一凹刻图案以及第二凹刻图案。第一凹刻图案与第二凹刻图案位于介电层的表面之下。第一线路以及这些第二线路分别配置于第一凹刻图案与第二凹刻图案内。第一线路为屏蔽线路，而第二线路为信号传输线路。第一线路的厚度大于每条第二线路的厚度。第一线路可以配置在这些第二线路之间，以避免这些第二线路内的电子信号互相干扰。
摘要（英）：

The invention discloses a circuit structure of circuit board and circuit technique thereof. A circuit board structure includes a dielectric layer, at least a first circuit and a plurality of second circuits. The dielectric layer has a surface, first intaglio patterns and second intaglio patterns. The first intaglio patterns and the second intaglio patterns are engraved under the surface. The firstcircuit and these second circuits are respectively provided in the first intaglio patterns and the second intaglio patterns. The first circuit is a shielded line, and the second circuits are transmission lines. The thickness of the first circuit is greater than the thickness of each of the second circuits. The first circuit can be configured between these second circuits, in order to avoid the mutual interference of electronic signals in these second circuits.

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